Editorial Committee

The editorial committee is in charge of suggesting news for inclusion in the web site and monthly newsletter. These may pertain to the use of magnetic materials in products and technology, market, patents, education, ground-breaking science.

Leon ABELMANN
Saarbrücken, Germany

Stephen BLUNDELL
Oxford, UK

Paolo BORTOLOTTI
Thales, France

Ekkes BRÜCK
Delft, The Netherlands

Nora DEMPSEY
Grenoble, France

Dino FIORANI
Roma, Italy

Martin GRÖNEFELD
Magnetfabrik Bonn, Germany

Oliver GUTFLEISCH
Darmstadt, Germany

Thomas HAUET
Nancy, France

Burkard HILLEBRANDS
Kaiserslautern, Germany

Emmanuel KENTZINGER
Jülich, Germany

Xavi MARTI
IGS Research, Czech Republic

John ORMEROD
JOC LLC, USA

Lucian PREJBEANU
Grenoble, France

Hans Werner SCHUMACHER
The National Metrology Institute of Germany

Nicolas VUKADINOVIC
Dassault Aviation, France

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News

ESM turns remote in 2020

24/08/2020

The contingency measures induced by the pandemic give us a unique opportunity for pioneering an e-ESM, an online higher-education Magnetism event. We believe that on-line and on-site education both have their rightful place in the education environment. While nothing may ever replace enthusiasm fostered by face-to-face meeting, online environments offer opportunities than are often not implemented on-site meetings.
> Read more
SpintronicFactory releases its roadmap for spintronics

19/08/2020

STF, a European consortium under the umbrella of EMA, publishes in the journal Nature Electronics an ambitious roadmap for spintronics. This discipline on the borderline between magnetism and microelectronics is indeed reaching maturity, offering broad prospects for innovation.
> Read more
SpintronicFactory releases its roadmap for spintronics

19/08/2020

STF, a European consortium under the umbrella of EMA, publishes in the journal Nature Electronics an ambitious roadmap for spintronics. This discipline on the borderline between magnetism and microelectronics is indeed reaching maturity, offering broad prospects for innovation.
> Read more

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